At the 4G/5G summit in Hong Kong, Qualcomm unveiled its latest mid-range chipsets int he Snapdragon 400 and Snapdragon 600 tiers. First in line is the Snapdragon 427, which is the successor to the company’s budget oriented Snapdragon 425 chipset. The biggest improvement for the Snapdragon 427 chipset is the inclusion of Qualcomm’s X9 LTE modem that supports Cat 7 download speeds of up to 300Mbps.

The chipset also comes with an integrated DSP, support for Dual Camera setup, and boasts of Qualcomm’s TruSignal technology for improved network reception. Other improvements for the chipset include support for up to 8GB RAM and Quick Charge 3.0. The CPU and GPU speeds have also been boosted, though Qualcomm did not reveal the exact numbers for them.

Next, the company unveiled the Snapdragon 626 chipset which also comes with its X9 LTE modem that supports Cat 7 LTE speed (downlink). Boasting of 10 percent performance improvement, the chipset will be clocked as high as up to 2.2GHz. It will also come with Qualcomm’s TruSignal technology. Other improvements include support for dual camera and Quick Charge 3.0.

Lastly, the Snapdragon 653 is Qualcomm’s new flagship mid-range chip and successor to its impressive Snapdragon 652 chipset. The chipset boasts of 10 percent performance improvement thanks to an increase in clock speed to 1.95GHz (vs. 1.8GHz on Snapdragon 652). It also supports 8GB RAM, dual camera setup, and Qualcomm’s X9 LTE modem and Enhanced Voice services that make VoLTE calls sound even better.

The Snapdragon 652 and 626 chipsets will start showing up in devices from the end of 2016, with Snapdragon 427 making its debut in early 2017.